MediaTek Unveils Dimensity 7300 and 7300X SoCs

MediaTek has introduced its latest 4nm SoCs, the Dimensity 7300 and 7300X, designed for smartphones and foldables, respectively. These chips promise significant power efficiency improvements and advanced capabilities for midrange devices.

Key Features

Power Efficiency:

• Fabricated using a 4nm process, these chips feature four Arm Cortex A78 performance cores and four A55 efficiency cores. Compared to the 6nm Dimensity 7050, the new SoCs use up to 25% less power for CPU tasks.
• The Mali-G615 GPU in these chips is up to 20% more energy-efficient, though MediaTek did not specify the comparison baseline in their press release.

Enhanced Photography and AI:

• The Dimensity 7300 series supports up to 12-bit HDR photography with cameras up to 200 megapixels.
• The chips offer up to 30% faster autofocus and can 'remaster' photos 50% quicker than previous models.
• Equipped with the MediaTek APU 655, these SoCs are twice as fast at handling AI tasks compared to their predecessors.

Display Support:

• Both chips support displays up to 2880x1200 pixels.
• The Dimensity 7300X is optimized for dual-screen setups, targeting foldable devices.

Expected Devices

The first smartphone expected to feature the Dimensity 7300X is the Motorola Razr 50, rumored to be announced in June. MediaTek's advancements in power efficiency and AI processing promise to enhance the performance and battery life of upcoming midrange smartphones and foldables.

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